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90x90mm High-Precision BGA Solder Paste Stencil

33.99 $

🏷️ 状態: New

🚚 発送元: HK倉庫 – 香港

↩️ 簡単返品 受領後30日以内

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This high-precision 90×90 mm direct heating BGA stencil is ideal for computer component assembly, featuring a durable, dark-colored metal surface with a fine grid of uniform 0.50mm diameter apertures for accurate solder paste application. Its rectangular shape with rounded corners ensures easy alignment and seamless integration into your manufacturing process. Designed to meet international standards for voltage and power dissipation, this customizable stencil supports drive IC applications and offers reliable, high-quality performance. Perfect for professionals who demand precision and durability, it provides an efficient solution for complex electronic assembly tasks.

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