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Universal BGA Soldering & Reballing Base for Phone ICs

50.99 $

🆓 DARMOWA wysyłka z numerem śledzenia!

✅ Brak podatków importowych przy dostawie!

🏷️ Stan: New

🚚 Wysyłka z: Magazyn HK – Hongkong

↩️ Łatwe zwroty w ciągu 30 dni od odbioru

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Enhance your phone CPU and IC reballing or soldering repairs with this universal strong core BGA stencil positioning tin pad insulation base, available in vibrant blue or orange. Crafted from durable, heat-resistant silicone or rubber, it provides precise alignment with three engraved measurement sections (0.4mm, 0.5mm, 0.8mm on the blue base; 0.3mm, 0.45mm, 0.77mm on the orange base), ensuring accurate placement for sensitive electronic components. The sturdy yet flexible design features elongated slots along the edges for easy securing and positioning, making it an essential tool for professional repairs. Improve your repair efficiency with this organized, reliable insulation base, tailored for meticulous soldering tasks.

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