Universal BGA Reballing Stencil for Precise Repairs

41.99 $

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🏷️ Stan: New

🚚 Wysyłka z: Magazyn HK – Hongkong

↩️ Łatwe zwroty w ciągu 30 dni od odbioru

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Enhance your electronics repair toolkit with this high-quality universal BGA reballing stencil, featuring precise square holes ranging from 0.24 mm to 1.27 mm in size. Crafted from durable, polished metal with smooth, finished edges, it offers two thickness options of 0.12mm and 0.15mm for versatile use on mobile phones, laptops, CPUs, and IC chips. The stencil’s structured grid and clear red dimension markings ensure accurate solder ball placement, making it ideal for professional and DIY reballing projects. Its sleek, reflective surface and minimalist design provide both functionality and a refined aesthetic, helping you achieve perfect reballing results every time.

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