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MECHANIC La-03 White Glass BGA Reballing Pad

40.99 $

🏷️ Tilstand: New

🚚 Sendes fra: HK-lager – Hongkong

↩️ Enkle returer innen 30 dager etter mottak

🙋 Spørsmål? Kontakt Jake

Experience precise BGA reballing with this 20x20mm white glass pad, designed for CPU, GPU, and phone motherboard chip repair. Featuring an anti-blowout solder design, it prevents solder ball popping during reballing, ensuring clean and reliable results. Its sleek, reflective surface and gold-colored grid pattern facilitate accurate placement of solder balls, while the textured black backing provides stability and insulation during use. This professional-grade accessory is an essential tool for technicians seeking to enhance their reballing process, combining durability, safety, and precision in one high-quality solution. Ideal for achieving flawless soldering on motherboard components.

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