BGA Stencil for N17E-G2-A1, N17E-G3-A1 Models

43.99 $

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🏷️ Būklė: Refurbished

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The Direct Heating Stencil is designed for precision soldering of BGA chips with model numbers N17E-G2-A1, N17E-G3-A1, N18E-G0-A1, TU106-725-KD-A1, and N17E-G1-A1. Crafted from durable metallic material, it features a thickness of 0.5 mm and a dense grid of holes for optimal solder application. Recommended baking temperature is 100°-110°, while maximum soldering temperatures are 245°-260° for lead-free and 180°-205° for leaded BGA. This stencil is essential for skilled engineers dedicated to meticulous chip handling and soldering.

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