High-Precision iPhone BGA Reballing Stencil Kit

33.99 $

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🏷️ Condizione: New

🚚 Spedito da: Magazzino HK – Hong Kong

↩️ Resi facili entro 30 giorni dalla ricezione

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This high-precision BGA stencil kit measures 101x80mm, crafted from durable metal, and is specifically designed for reballing applications on iPhone models from 7 to 16, including CPU, NAND, WiFi, baseband, and NFC chips. The kit features a sleek rectangular stencil with precisely cut apertures arranged in a grid pattern, complemented by a magnetic pad for secure positioning. Its smooth, polished surface and rounded edges reflect meticulous craftsmanship, making delicate electronic repairs more manageable. Perfect for DIY enthusiasts, this professional-grade tool enables accurate component rework, ensuring reliable performance. Packaged in a convenient bag, it offers a practical solution for precise micro-soldering tasks.

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