CD3217 BGA Chip Stencil 0.3mm Stainless Steel

49.99 $

🆓 LIVRAISON GRATUITE avec numéro de suivi !

✅ Aucune taxe d'import à la livraison !

🏷️ État : Refurbished

🚚 Expédié depuis : Entrepôt HK – Hong Kong

↩️ Retours faciles sous 30 jours après réception

🙋 Une question ? Contacter Jake

This high-precision BGA chip stencil is designed for models CD3217, CD3218B12, and CD3217B12CACER, featuring a thickness of 0.3mm. Made from durable stainless steel, its grid of small round openings ensures accurate soldering for BGA chips. Ideal soldering temperatures range from 245°–260°C for Lead-Free and 180°–205°C for Leaded chips. To maintain optimal performance, it is recommended to use a baking chamber for 24 hours at 100°–110°C to avoid moisture-related issues. This stencil meets international standards for electrical specifications, making it suitable for professional computer applications.

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