Universal BGA Reballing Stencil Set for Mobile and Laptop Chips

31.99 

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🏷️ Condition: New

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

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This high-quality universal BGA reballing stencil set features three metal sheets in options A, B, and C, with a sleek, industrial design finished in matte or semi-gloss. Each stencil has precisely cut square holes of various sizes, including 0.5/10×16 mm, 0.63/8×25 mm, and 0.35/4×48 mm, arranged in an organized grid pattern, ideal for reballing CPU and IC chips on mobile phones and laptops. Made with durable material available in thicknesses of 0.12mm or 0.15mm, these stencils are suitable for direct heating applications. Packaged in a bag, this versatile 3-in-1 set ensures professional, accurate reballing for high-precision electronics repair.

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