RMA-223 10cc BGA Solder Paste for PCB Rework

Price range: 32.99 € through 46.99 €

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🏷️ Condition: New

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

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Achieve precise soldering with this high-quality RMA-223 10cc BGA tin solder paste flux. Designed for PCB, BGA, and PGA rework and reballing of computer and phone chips, it features a high-viscosity, no-clean formulation that ensures excellent adhesion, high joint strength, and good insulation. The bright yellow paste comes in a compact 93 x 33 x 23 mm syringe with particle sizes of 1-10μm, offering easy peeling and residue-free removal. Ideal for both professional and DIY applications, it effectively prevents oxidation, contamination, and deterioration, boosting production efficiency and ensuring a reliable, clean soldering process every time.

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