Lead-Free Solder Paste for Phone Repairs

This Lead-Free Solder Paste Enhances Your Repairs

The Lead-Free 183℃ Medium Temperature Soldering Paste is crafted for precision and efficiency in your mobile repair tasks. Featuring a blend of Sn64.7%, Bi35.0%, and Ag0.3%, this solder paste ensures excellent performance for PCB, BGA, and motherboard repairs. Easy to handle, it comes in a convenient 4-IN-1 syringe that allows for precise application to meet your unique project needs. Whether you're a seasoned technician or a DIY enthusiast, you'll find this solder paste enhances your soldering experience, achieving reliable and durable connections. Say goodbye to faulty repairs and embrace the quality that this product offers.

Key features of this Lead-Free Solder Paste

• Medium temperature soldering paste with a melting point of 183℃.
• Composed of 64.7% Tin, 35% Bismuth, and 0.3% Silver.
• Perfect for a range of repairs including phone PCB and BGA work.
• Weighs approximately 25g, making it manageable for detailed tasks.
• Comes in a 4-IN-1 syringe for precise and controlled application.
• Crafted specifically for efficient use in mobile repair tools.

Experience Exceptional Quality with this Solder Paste

Investing in this Lead-Free Solder Paste means you’re choosing reliability for all your electronic repairs. Imagine accomplishing intricate soldering tasks effortlessly, knowing you have the best tools at your disposal. Enhance your toolkit today, and enjoy the seamless repairs ahead!