High-Precision Qualcomm Snapdragon BGA Reballing Stencil

Price range: 34.99 € through 75.99 €

🆓 FREE SHIPPING with tracking number!

✅ No Import Taxes on delivery!

🏷️ Condition: New

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

🙋 Any questions? Contact Jake

Enhance your electronic repair toolkit with this high-precision BGA reballing stencil compatible with Qualcomm Snapdragon CPUs, including models 888, 870, 8Gen2, 680, 765G, 775G, SM7250, SM7350, SM8350, SM8450, SM7325, and MSM8898. Crafted from durable, non-chemical material with a thickness of 0.12mm, it features a clean, technical aesthetic with white outlines and markings on a light gray background. The stencil offers multiple configurations such as U-QSD1, U-QSD10, U-QSD11, and U-QSU1-5, with geometric patterns arranged in structured grids to ensure accurate reballing. Its precise design supports seamless alignment and optimized solder ball placement for professional-quality repairs.

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