This Precision BGA Reballing Stencil for Qualcomm
Experience the ultimate in electronic repair with this this high-precision BGA reballing stencil designed specifically for Qualcomm Snapdragon CPUs. Crafted with a thickness of just 0.12mm, it ensures unparalleled accuracy for professional reballing and rework processes. The stencil’s crisp, clean geometric patterns and organized layout allow for effortless alignment and precise solder ball placement. Available in various models and configurations, including U-QSD1, U-QSD11, U-QSU1, and more, it suits a wide range of Snapdragon chips like 888, 870, 8Gen2, 680, and Snapdragon series SM7250, SM7350, SM8350, among others. Its minimalistic, technical aesthetic—featuring white lines on a light gray background—supports a highly organized workflow for reliable, quality repairs.
Key features of this this BGA Reballing Stencil
- Designed for precise reballing of Qualcomm Snapdragon CPUs, supporting models 888, 870, 8Gen2, 680, 765G, 775G, SM7250, SM7350, SM8350, SM8450, SM7325, MSM8898, and more.
- Made from durable, non-chemical materials with a thickness of 0.12mm for detailed, safe solder ball placement and consistent results every time.
- Features a clear, technical aesthetic with white outline patterns on a light gray background, emphasizing accuracy and ease of alignment during repairs.
- Includes various configurations such as U-QSD1, U-QSD10, U-QSD11, U-QSU1, U-QSU1-5, supporting a broad range of compatible MCU models and chip variations.
- Rectangular, standardized size with precise cutouts and markings for seamless integration into professional electronic repair tools and processes.
- Ideal for DIY electronics repair kits and professional repair stations needing reliable, high-quality BGA reballing templates with detailed design features.
This this BGA Reballing Stencil is perfect for your repair toolkit
Invest in this this BGA reballing stencil now to elevate your electronic repair projects. Its precision design and versatile compatibility make it an essential, trustworthy tool for repairing high-end Snapdragon CPUs. Achieve professional-level results with ease and confidence, knowing you’re using a technically advanced stencil built for accuracy and durability. Whether you’re a seasoned technician or an advanced enthusiast, this stencil helps ensure your reballing process is smooth, precise, and reliable. Elevate your repair game today with this essential component.
Your electronics deserve the best care. With this this BGA stencil, you are equipped for expert-level repairs, ensuring optimal performance and longevity of your Snapdragon devices. Make your next project your best yet and enjoy the confidence that comes with using a top-quality, precisely engineered tool.























