High-Precision Lead-Free Solder Paste HXP-603/604

Price range: 32.99 € through 58.99 €

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This high-quality lead-free solder paste comes in two models, HXP-603 and HXP-604, both with a melting point of 217°C (422.6°F). HXP-603 features 87.12% tin, 0.616% copper, and 0.264% silver, while HXP-604 contains 77.2% tin, 0.44% copper, and 2.64% silver, each with 12% flux. The delicate, smooth paste is resin-based, halogen-free, and designed for high-temperature resistance applications like mobile phone and precision component repairs. Supplied in syringe form for precise application, it ensures bright, full solder joints and is ideal for SMT processes with operation temperatures above 300°C. Available in 10g, 35g, and 55g, in various color options.

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