CD3217 BGA Chip Stencil 0.3mm Stainless Steel

29.99 

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🏷️ Condition: Refurbished

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

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This high-precision BGA chip stencil is designed for models CD3217, CD3218B12, and CD3217B12CACER, featuring a thickness of 0.3mm. Made from durable stainless steel, its grid of small round openings ensures accurate soldering for BGA chips. Ideal soldering temperatures range from 245°–260°C for Lead-Free and 180°–205°C for Leaded chips. To maintain optimal performance, it is recommended to use a baking chamber for 24 hours at 100°–110°C to avoid moisture-related issues. This stencil meets international standards for electrical specifications, making it suitable for professional computer applications.

Only 2 left in stock

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