BGA Reballing Stencil Kit for iPhone Series

Price range: 58.99 € through 228.99 €

🆓 FREE SHIPPING with tracking number!

✅ No Import Taxes on delivery!

🏷️ Condition: New

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

🙋 Any questions? Contact Jake

Achieve precise reballing with this high-quality BGA stencil kit designed for iPhone X, 11, 12, 13, 14, 15, and 16 series motherboards, specifically targeting the middle layer logic board. Crafted from durable, corrosion-resistant metal with a smooth, metallic finish, the stencil features a detailed, dashed outline of solder pad areas for accurate placement. It includes a tin planting platform for precise solder ball application, available in multiple colors—A, B, C, D, E, F, or full set—and benefits from a magnetic base for stability. Ideal for professional and DIY electronics repair, this kit ensures high accuracy, durability, and ease of use.

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