AMD Ryzen BGA Reballing & Tin-Planting Stencil

Price range: 45.99 € through 81.99 €

🆓 FREE SHIPPING with tracking number!

✅ No Import Taxes on delivery!

🏷️ Condition: New

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

🙋 Any questions? Contact Jake

The XZZ BGA stencil is a high-precision reballing and tin-planting platform designed for AMD Ryzen processors, including R5, R7, R3, R9, and models such as 4500, 4800H, and 4700U. Crafted from durable materials with a 0.40mm hole size, it features a sleek rectangular design with rounded corners for optimal handling. The kit includes a magnetic four-magnet base and a positioning plate, ensuring accurate alignment during direct heating processes. Its industrial aesthetic combines metallic finishes with matte black components, emphasizing durability and professional craftsmanship. Perfect for experienced enthusiasts, this easy-to-use tool guarantees consistent, precise results for reballing and tin-plating projects.

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