This high-performance phase change thermal pad for cooling
Experience superior thermal management with this high-conductivity phase change thermal pad, designed for demanding PC, GPU, and power supply cooling tasks. At 8.5 W/mK, it efficiently transfers heat while maintaining low thermal impedance of just 0.04°C·cm²/W. The pad’s unique phase change at 45°C allows it to transition from solid to liquid, conforming perfectly to surfaces and improving contact, then reverts back upon cooling to ensure long-lasting reliability. Available in multiple sizes, including 20x20mm, 30x51mm, 40x40mm, 40x80mm, 80x80mm, and 80x160mm, this versatile material can be tailored to fit various application needs. Its ability to withstand extreme temperature cycles (-55°C to +125°C) and high baking temperatures (150°C for 1000 hours) guarantees durable performance and efficient heat dissipation under intense operational conditions.
Keys features of this high-performance thermal pad
- High thermal conductivity of 8.5 W/mK ensures rapid heat transfer from CPU, GPU, and other devices for stable performance and extended lifespan.
- It features a phase change at 45°C, enabling the material to liquefy, fill gaps, and improve contact before solidifying for reliable long-term operation.
- The pad’s low thermal impedance of 0.04°C·cm²/W maintains efficient heat flow, reducing the risk of overheating during intensive processing tasks.
- Constructed with a specific gravity of 2.8 g/cm³ and a volume resistivity of 2.1×10¹⁴ Ω·cm, providing electrical insulation and mechanical durability.
- Multiple sizes facilitate precise applications, customizable thickness levels from 0.02mm to 0.25mm, perfect for various cooling modules and custom setups.
- Manufactured to endure 1000 thermal cycles between -55°C and +125°C and baked at 150°C for 1000 hours, ensuring high reliability and durability over time.
This thermal pad is perfect for your cooling needs, buy now!
Imagine confidently installing this phase change thermal pad in your high-performance PC or gaming console, knowing you have a reliable, efficient heat management solution. Its ability to adapt dynamically to temperature changes ensures optimal contact and heat dissipation, providing peace of mind during extended use. Whether you're upgrading your system or maintaining critical components, this product offers excellent thermal performance and durability. Invest in this innovative solution today to keep your devices running smoothly and prevent overheating, enjoying stable, consistent performance in all your demanding computing tasks.























