DJI Drone BGA Reballing Stencil for IC Chips

Price range: 36.99 € through 46.99 €

🆓 FREE SHIPPING with tracking number!

✅ No Import Taxes on delivery!

🏷️ Condition: New

🚚 Ships from: HK Warehouse – Hong Kong (China)

↩️ Easy Returns within 30 days of receipt

🙋 Any questions? Contact Jake

This durable BGA reballing stencil is designed for DJI drone IC chips, compatible with models BGA96, BGA60, BGA153, BGA178, BGA200, BGA221, BGA84, LC1860C, DM365ZCE30, and LC1160. Made from a high-quality combination material, it features precise white apertures arranged in complex and grid patterns to facilitate accurate reballing and repair tasks. Suitable for DIY electronic repairs, the stencil is available in versatile color options including “2 in 1,” “DJ 1,” and “DJ 2.” Its non-customized design and compact bag packaging make it an essential tool for technicians seeking precision and reliability in reworking DJI drone IC chips.

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